{"id":4098,"date":"2026-03-13T10:11:41","date_gmt":"2026-03-13T10:11:41","guid":{"rendered":"https:\/\/kangchuangpapers.com\/?post_type=product&#038;p=4098"},"modified":"2026-06-03T06:32:21","modified_gmt":"2026-06-03T06:32:21","slug":"pcb-board-separator-sulfur-free-paper","status":"publish","type":"product","link":"https:\/\/kangchuangpapers.com\/ja\/product\/pcb-board-separator-sulfur-free-paper\/","title":{"rendered":"PCB board separator sulfur-free paper"},"content":{"rendered":"<h2 class=\"wp-block-heading\">Industrial Paper for PCB Circuit Board Manufacturing<\/h2>\n\n\n\n<p>In the full PCB production workflow, beyond the core sulfur-free paper, the following specialized industrial papers are classified across five key process stages: process manufacturing, surface treatment, lamination &amp; encapsulation, cleaning &amp; wiping, and packaging &amp; transportation.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">I. Process Manufacturing (Core Production)<\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li>PCB Sulfuric Acid Paper (Alias: PCB Tracing Paper) Semi-transparent and heat-resistant, used for circuit design transfer printing and photoresist matching. Commonly used in DIY and small-batch prototype production, ensuring micron-level circuit reproduction without deformation or carbonization under high-temperature transfer.<\/li>\n\n\n\n<li>PCB Heat Transfer Paper Available as yellow matte heat transfer paper and PnP blue paper (polyester substrate). Circuit diagrams are laser-printed in mirror image and heat-transferred onto copper-clad boards to form etch-resistant patterns, replacing traditional photolithography. Suitable for small-batch production.<\/li>\n\n\n\n<li>PCB Interlayer Paper (Aliases: Circuit Board Separator Paper, Circuit Board Pad Paper) Protects OSP coatings and immersion silver\/gold surfaces. Used for stacking isolation to prevent scratching and oxidation. Low sulfur content (some are sulfur-free formulas), compatible with immersion silver, gold-plated, and other high-precision PCBs.<\/li>\n\n\n\n<li>Copper-Clad Laminate Base Paper High-performance wood pulp paper that can be impregnated with phenolic resin to produce build-up circuit boards, or combined with epoxy resin and glass cloth as a substitute for fiberglass boards. Features high wet strength, no breakage during resin impregnation, and excellent permeability.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">II. Surface Treatment (Electroplating \/ Etching \/ OSP)<\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li>PCB Immersion Silver Process Pad Paper Sulfur-free and chlorine-free, preventing chemical reactions between sulfur and silver that cause yellowing. Used for inter-board isolation and protection during immersion silver board production.<\/li>\n\n\n\n<li>PCB Immersion Gold Anti-Oxidation Separator Paper Sulfur-free and dust-free, preventing oxidation and scratching of gold-plated layers. Compatible with immersion gold boards and gold finger boards during processing and storage. (Note: Immersion gold and immersion silver processes use sulfur-free paper.)<\/li>\n\n\n\n<li>OSP Protection Paper Specially coated and compatible with OSP coatings without reaction. Prevents OSP board surfaces from absorbing moisture and contamination, maintaining coating stability.<\/li>\n\n\n\n<li>Anti-Etching Paper (Anti-Rust Category) Heat-resistant and chemically corrosion-resistant, used to mask non-etching areas during manual etching as a dry film substitute. Suitable for simple circuit board production.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">III. Lamination &amp; Encapsulation (Multilayer Board Production)<\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li>PCB Release Paper (Alias: Demolding Paper) Silicone-coated, used during multilayer board lamination to separate prepreg (PP sheets) from press boards, preventing adhesion and ensuring clean demolding after lamination with no adhesive residue.<\/li>\n\n\n\n<li>Prepreg Isolation Paper Heat-resistant above 200\u00b0C, used to isolate prepreg during storage and cutting, keeping the adhesive film surface clean to ensure lamination adhesion and insulation performance.<\/li>\n\n\n\n<li>PCB Insulation Paper (Aliases: Nomex Paper, Kapton Paper) High-temperature resistant with high dielectric strength, used for internal PCB insulation, heat dissipation, and cushioning. Compatible with power boards, industrial control boards, and other high-voltage circuit boards.<\/li>\n\n\n\n<li>PCB High-Temperature Resistant Lining Paper Withstands temperatures above 250\u00b0C, used for positioning and protecting PCBs during lamination, preventing surface impressions and contamination. Leaves no marks after lamination.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">IV. Cleaning &amp; Wiping (Cleanroom Environment)<\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li>PCB Dust-Free Paper (Aliases: Stencil Wiping Paper, Auto Wiping Paper) Composed of 55% wood pulp and 45% polyester fiber. Extremely low particle generation (\u2264Class 10), fast liquid absorption. Used for SMT stencil cleaning, PCB surface dust and adhesive removal, and post-plating cleaning. Compatible with Class 100 to Class 1000 cleanroom environments.<\/li>\n\n\n\n<li>PCB Anti-Static Dust-Free Paper Surface electrostatic resistance of 10\u2077\u201310\u2079\u03a9, compliant with ANSI\/ESD S20.20 standard. Eliminates static buildup and prevents dust adsorption. Used for cleaning high-precision PCBs and electronic components.<\/li>\n\n\n\n<li>PCB Absorbent Paper (Alias: Oil-Absorbent Paper) High water absorbency with no fiber shedding. Used for post-wash water absorption on PCBs and plating solution adsorption, preventing water stains from affecting product quality.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">V. Packaging &amp; Transportation (Finished Product Protection)<\/h2>\n\n\n\n<ol class=\"wp-block-list\">\n<li>PCB Anti-Static Paper Special conductive coating for rapid static discharge. Surface resistivity of 10\u2076\u201310\u00b9\u00b9\u03a9, preventing electrostatic breakdown of PCB chips and components. Used for finished PCB packaging and transportation.<\/li>\n\n\n\n<li>PCB Moisture-Proof Paper (Alias: Moisture-Proof Composite Paper) Polyethylene-coated or aluminum foil composite. Blocks moisture vapor (moisture transmission rate \u22645g\/m\u00b2\u00b724h), preventing PCB moisture absorption, oxidation, and solder joint corrosion. Suitable for long-distance sea freight and storage in humid regions.<\/li>\n\n\n\n<li>PCB Anti-Rust Paper Coated with vapor-phase rust inhibitor. Used for packaging PCB assemblies containing metal components, preventing rust on copper, iron, and other metal parts. Compatible with military-grade and automotive electronics PCBs.<\/li>\n\n\n\n<li>PCB Halogen-Free Paper Contains no halogens (chlorine and bromine \u2264900ppm), compliant with RoHS and REACH standards. Used for high-end electronic device PCB packaging, preventing toxic gas generation during combustion.<\/li>\n\n\n\n<li>PCB Packaging Kraft Paper 45\u201380g, high strength and tear-resistant. Used for inner lining and overall wrapping of PCB outer cartons, providing cushioning and shock protection. Some formulas are sulfur-free and halogen-free, meeting environmental requirements.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">Comparison: Core Products vs. Sulfur-Free Paper<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><td><strong>Product Name<\/strong><\/td><td><strong>Key Difference from Sulfur-Free Paper<\/strong><\/td><td><strong>Application Scenario<\/strong><\/td><\/tr><\/thead><tbody><tr><td>PCB Interlayer Paper<\/td><td>Some are low-sulfur formula, focuses on physical isolation and scratch prevention<\/td><td>General PCB stacking and storage<\/td><\/tr><tr><td>Sulfur-Free Paper<\/td><td>Sulfur content \u226420ppm, focuses on preventing sulfurization chemical reactions<\/td><td>Immersion silver, gold-plated, OSP, and other high-precision PCBs<\/td><\/tr><tr><td>Anti-Static Paper<\/td><td>Core function is static protection, can also be sulfur-free<\/td><td>Electrostatic-sensitive PCBs and components<\/td><\/tr><tr><td>Dust-Free Paper<\/td><td>Core function is low particle generation, used for cleaning<\/td><td>PCB surface dusting, SMT stencil cleaning<\/td><\/tr><tr><td>Release Paper<\/td><td>Core function is demolding and anti-adhesion, used in lamination<\/td><td>Multilayer board lamination, prepreg storage<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Key Specifications Summary<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Common Grammages: 25g, 30g, 35g, 40g (lightweight isolation); 45g, 60g, 80g (packaging and pad boards); 120g and above (heavy-duty protection)<\/li>\n\n\n\n<li>Core Indicators: Sulfur-free paper sulfur content \u226420ppm; anti-static paper surface resistance 10\u2077\u201310\u2079\u03a9; dust-free paper particle generation \u2264Class 10; moisture-proof paper moisture transmission rate \u22645g\/m\u00b2\u00b724h<\/li>\n<\/ul>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Industrial Paper for PCB Circuit Board Manufacturing In the full PCB production workflow, beyond the core sulfur-free paper, the following specialized industrial papers are classified across five key process stages: process manufacturing, surface treatment, lamination &amp; encapsulation, cleaning &amp; wiping, and packaging &amp; transportation. I. Process Manufacturing (Core Production) II. Surface Treatment (Electroplating \/ Etching \/ OSP) III. Lamination &amp; Encapsulation (Multilayer Board Production) IV. Cleaning &amp; Wiping (Cleanroom Environment) V. Packaging &amp; Transportation (Finished Product Protection) Comparison: Core Products vs. Sulfur-Free Paper Product Name Key Difference from Sulfur-Free Paper Application Scenario PCB Interlayer Paper Some are low-sulfur formula, focuses on physical isolation and scratch prevention General PCB stacking and [&hellip;]<\/p>\n","protected":false},"featured_media":4149,"template":"","format":"standard","meta":{"_acf_changed":true},"product-category":[10,9],"class_list":["post-4098","product","type-product","status-publish","format-standard","has-post-thumbnail","hentry","product-category-electroplated-sulfur-free-paper","product-category-sulfur-free-paper"],"acf":[],"_links":{"self":[{"href":"https:\/\/kangchuangpapers.com\/ja\/wp-json\/wp\/v2\/product\/4098","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/kangchuangpapers.com\/ja\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/kangchuangpapers.com\/ja\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/kangchuangpapers.com\/ja\/wp-json\/wp\/v2\/media\/4149"}],"wp:attachment":[{"href":"https:\/\/kangchuangpapers.com\/ja\/wp-json\/wp\/v2\/media?parent=4098"}],"wp:term":[{"taxonomy":"product-category","embeddable":true,"href":"https:\/\/kangchuangpapers.com\/ja\/wp-json\/wp\/v2\/product-category?post=4098"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}